Alchip Presents Advanced ASIC Capabilities at AI Infra Summit

VERA Brief

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Alchip Technologies is presenting its advanced ASIC design and packaging capabilities, including 3nm production and 2nm design, at the AI Infra Summit 2026. The company is also highlighting its 3DIC and multi-die advanced packaging solutions, focusing on the physical realization of AI processing units.

Key facts

• Alchip Technologies is exhibiting at the AI Infra Summit 2026.
• The company will showcase its advancements in 3nm production and 2nm design.
• Alchip's exhibit will feature 3DIC capabilities and multi-die advanced packaging solutions.
• The demonstration focuses on the physical realization of complex AI processing units.
• The AI Infra Summit is a platform for industry leaders to discuss AI development and deployment infrastructure.