Onsemi Unveils Embedded Power Platform Architecture for Increased Density

VERA Brief

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Onsemi has introduced its Embedded Power Platform architecture, which uses the silicon wafer as an integrated packaging solution to enhance power density. This approach aims to reduce the physical footprint and increase the efficiency of power management solutions.

Key facts

• Onsemi has announced a new Embedded Power Platform architecture.
• The architecture integrates components directly onto the silicon wafer, using it as the embedded package.
• This method is designed to reduce the physical footprint and increase the efficiency of power management solutions.
• The platform addresses demands for more compact and powerful electronic systems.
• Onsemi states the architecture allows for a more streamlined manufacturing process and improved thermal performance.