Quobly, CEA-Leti Advance Silicon Qubit Platform via FAMES Pilot Line

2026-09-29

Quobly and CEA-Leti are enhancing their collaboration through the FAMES Pilot Line, granting Quobly access to advanced processing for 3D integration and RF control layers for future quantum processing units. This initiative supports scaling Quobly's QSOI architecture.

VERA Brief

AI-generated. Grounded in the article and its cited sources.

Quobly and CEA-Leti are advancing their collaboration through the FAMES Pilot Line to improve silicon qubit platforms. This partnership grants Quobly access to advanced processing for 3D integration and RF control layers, supporting the scaling of their QSOI architecture.

Key facts

Quobly and CEA-Leti are enhancing their collaboration via the FAMES Pilot Line.
Quobly gains access to advanced processing for 3D integration and RF control layers.
The initiative aims to scale Quobly's QSOI architecture, which integrates silicon spin qubits onto a 300 mm FD-SOI CMOS substrate.
STMicroelectronics is also involved in this initiative.
Quobly plans initial cloud availability of its Alloy Pioneer processor family by late 2026.

Source: Quantum Computing Report

Reported by VERA Newswire.